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| Semiconductor microcircuits are available from some manufacturers in unpackaged form at a significantly lower cost than in packaged form. A compact, reduced cost circuit assembly is constructed by wedge bonding aluminum leads from connection pads on an unpackaged microcircuit directly to bare copper foil traces on a conventional circuit board, without the use of intermediate nickel and/or gold layers. The microcircuit, aluminum leads and lead bonding sites are enveloped with a low stress encapsulant which protects the microcircuit and mechanically mounts it to the circuit board. Circuit board space is saved because the unpackaged microcircuit is substantially smaller than a corresponding packaged microcircuit, and no socket or corresponding arrangement is required for making electrical connections. Cost is saved because a smaller circuit board may be used, the microcircuit is substantially less expensive in unpackaged form, no socket is required, and the nickel and/or gold interlayers conventionally required for bonding aluminum leads to copper traces is eliminated.This technology is beneficial in a wide range of high volume applications for circuit board mounted semiconductor microcircuits.unpackaged semiconductor microcircuit electrically connected mechanically mounted conventional board coefficient thermal expansion order 0000014-0000020 laminate CEM-1 material epoxy FR-4 copper foil surface conductors cleaning rinse (dilute sulfuric acid/sodium persulfate similar solution) aluminum leads wedge bonded directly nickel and/or gold interlayers bonding sites enveloped encapsulant covers components minimum depth mils hardens stress materials Hysol types 4402 4450 4451and 4650 Dexter Corporation |
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Interested? This is an abstract of a technology that is available for sale or license. yet2.com can introduce you confidentially to the owner of this technology.
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