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Metallic bond for mounting of optical fibers to integrated optical chips

A method for pigtailing an optical fiber to a lithium niobate integrated optical device (I/O chip) is shown and described wherein the bonding between the I/O chip and the optical fiber is a metallic bond. The lithium niobate may be attached to a metallic substrate which is welded to a metallic fiber optic carrier which is in turn welded to a metallized optical fiber. The fiber optic carrier may also be made of non-metallic materials which are given a metallic coating prior to attachment to the I/O chip by means of a metallic bond such as welding.

Patent Information

NumberUS  4867524
CountryUS
StatusIssued
Date09/19/1989


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