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Chip-on-board printed circuit manufacturing process using aluminum wire bonded to copper pads

In a process for fabricating a printed circuit board assembly carrying a chip on board type microcircuit package, aluminum wires are bonded to the aluminum pads on the microcircuit and to bare copper connector pads on the printed circuit board to form the electrical connection between them. The microcircuit, aluminum wires, and copper connection pads are then encapsulated with a material such as low stress liquid encapsulant having a thermal expansion coefficient approximately equal to that of the printed circuit board substrate material. Preferably the process includes steps of mounting the microcircuit and forming the copper connector pads on a printed circuit board laminate comprising cellulose epoxy mat such as CEM-1.

Patent Information

NumberUS  6006427
CountryUS
StatusIssued
Date12/28/1999


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