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| Honeywell's inventive technology provides a method for curing polymer insulating layers for IC interconnect fabrication. Organic polymer dielectric films are known to produce faster signal processing, lower power consumption, and reduced noise when incorporated into integrated circuits (IC). This process offers significant improvements by curing poly(arylene ether) or fluorinated poly(arylene ether) films with electron beam radiation. Exposure of the polymer layer to electron beam radiation causes chemical reactions leading to crosslinking of polymer chains. In IC interconnect structures made of aluminum or copper wiring patterns and polymer insulating layers, this unique crosslinking process decreases the difference in thermal expansion coefficient (TEC) between the wiring patterns and the polymer insulating layers. The result is lower mechanical stress and higher operating temperature limits. In addition, e-beam crosslinking leads to higher mechanical strength and glass transition temperatures, and greater resistance to aggressive organic solvents. This technology is relevant to microelectronic and communication applications. Specifically, the dielectric films may be used as protective layers in IC devices and substrates for circuit boards. Fiber optic waveguides may be produced with higher refractive index--leading to low optical losses for signal transmission.Honeywell dielectric coating substrate polymer layer onto poly(arylene ether) fluorinated deposition completed conventional spin-coating dip roller spraying CVD meniscus |
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