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| Honeywell has developed a new family of high boiling point, benign organic solvents for the manufacturing, processing and application of spin-on dielectric polymer solutions and an improved process for producing low dielectric films. Specifically, the solvents create high-temperature resistant arylene ether based polymers with a low dielectric constant, low moisture absorption, thermally-stable intermetal dielectrics for multilevel interconnections in integrated circuits and microelectronics packaging. Honeywell's arylene ether polymers are dissolved in an aromatic aliphatic ether solvent (such as anisole, methylanisole, or phenetole). The improved polyarylene ether is optimally formulated for spin-coating and yields totally striation-free, highly uniform films. Once spun onto a wafer's surface, polymers are thermally activated, undergo a cross-linking reaction, and are cured. Glass transition temperatures up to 450 degrees C are achieved without assistance from crosslinking additives. At the same time, a lower viscosity is attained--beneficial for the filtration of ion contaminants and particles and excellent for gap-filling. Improved filtration and gap-filling reduces manufacturing costs.dimensions integrated circuit (IC) interconnects undergo progressive shrinkage sub-quarter micron metal spacing organic polymer dielectrics necessity |
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