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| As feature sizes for integrated circuits become smaller, the demand for improved dielectric films continues to grow. Honeywell offers a novel method for producing improved low dielectric constant nanoporous films suitable for state-of-the-art interlevel and intermetal dielectric applications. The films have greater mechanical strength and are surface hydrophobic--without the need for additional processing. A thermal degradable polymer is used to create a foam structure with controlled porosity, dielectric constant, and mechanical strength. Significantly, these improvements are accomplished without the need for additional processing. The improved mechanical strength increases production yields.dielectric nanoporous film mixture least onespin-on-glass (SOG) material thermally degradable polymer soluble polar solvent onto substrate heating coated order remove |
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Interested? This is an abstract of a technology that is available for sale or license. yet2.com can introduce you confidentially to the owner of this technology.
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