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| The particle technology can eliminate the problem of solder balls. It provides an ideal solution both for current applications and for the new class of components having a high number of closely spaced leads with consequent requirements for solder pastes with an extremely high printing resolution.provider created ultrafine metal nonmetal particles nanoscale sub-micron range isolates nanoparticles maintaining concentrated state unique encapsulation facilitates handling storing ease wide applications novel known kind dispersed commercial quantities materials virtually solid |
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