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| Solder ink is used as a replacement for the hot air solder leveling (HASL) process. The particle technology has the potential to eliminate environmental pollutants and can significantly reduce both material and process costs. A simplified circuit pattern production method developed by the provider is used to deposit nanoscale metal particles accurately in a complex pattern onto a ceramic substrate. This process involves just 18 steps, compared to more than 100 in a standard manufacturing process.provider created ultrafine metal nonmetal particles nanoscale sub-micron range isolates nanoparticles maintaining concentrated state unique encapsulation facilitates handling storing ease wide applications novel known kind dispersed commercial quantities materials virtually solid |
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Interested? This is an abstract of a technology that is available for sale or license. yet2.com can introduce you confidentially to the owner of this technology.
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