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| DuPont offers the know-how to utilize hydroxylamine formulations for selective wet etching of certain metals in the presence of other metals at a selectivity of 10:1 or greater. This technology is useful in a variety of manufacturing processes such as semiconductor preparation, photo engraving, plastic and rubber die formation, and many others. Through both formulation and process-of-use modifications, DuPont has defined formulations and processes to minimize or maximize selectivity across pairs (or even groups) of metals. See the table in the long description section for a listing of some of the possible metal pairs in which DuPont EKC technology can be used to remove one metal in the presence of other metals. Both know-how and product needed to selectively wet etch are available.following table lists metal pairs |
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Interested? This is an abstract of a technology that is available for sale or license. yet2.com can introduce you confidentially to the owner of this technology.
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