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| DuPont offers technology for dense-phase fluid (supercritical CO2-based) cleaning of integrated circuits that is especially useful for the rapidly growing copper interconnect approach. Key features of this technology include (1) methods of process optimization based on analyses of spent supercritical carbon dioxide cleaning formulations, (2) recovery and purification of CO2 from spent cleaning formulations involving co-solvents, (3) recycle of recovered carbon dioxide, (4) apparatus and methods for load-lock systems for use in dense-phase fluid cleaning tools, (5) formulations for removal of post-dry-etch residues and copper contamination, and (6) dense-phase fluid cleaning processes using two fluids at different pressures, where the higher-pressure fluid is applied locally using nozzles directed towards the surfaces to be cleaned |
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Interested? This is an abstract of a technology that is available for sale or license. yet2.com can introduce you confidentially to the owner of this technology.
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