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| 3-dimesional high aspect ratio (>500) nano-scale CFx (fluorocarbon) “tube” and “test-tube” arrays were realized using Deep Reactive Ion Etching (RIE). Sidewall CFx nano structures formed by Deep RIE passivation process. The film thickness of CFx was controlled from 200 nm to 500 nm, and the height more than 100 µm was available. The DRIE process was applied to a novel fabrication process of 3-dimensional nano-scale fluorocarbon structures. High aspect ratio fluorocarbon tube or test-tube arrays were fabricated using the excessive CFx passivation structure followed by Si etching in a microchannel. This method enables to fabricate variety of 3-dimensional fluorocarbon structures with low surface energy, excellent chemical resistance, and prevention from protein adsorption and thermal stability This fluorocarbon tube array and test-tube array are useful tool for chemical reactors and cell bioreactors. Other possible applications are in production of the inkjet nozzles, valves for μTAS, as well as manufacturing which utilizes the Bosch Process.3-dimensional CFx structures SEM image array Deposition tube applied 30 minutes Diameter width depth microchannel 200 100m film thickness scallop DRIE nm 300nm controlled conditions passivation mode etching 500nm height case aspect ratio realized |
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