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| Liquid metal has been used as a coolant for system-level thermal management for decades in nuclear reactors. The reason is its efficiency -- liquid metal can have an effective thermal conductivity 10 to 100 times the thermal conductivity of copper. However, cost and long-term reliability of liquid metal cooling approaches have previously precluded its widespread use for cooling of high-performance and high-thermal-density electronics. In these applications, cost, size, weight, reliability, and efficient heat dissipation are paramount considerations.<br /><br /> Rockwell Collins has now developed a liquid metal cooling technology that solves these previous issues for thermal management in electronics. The Rockwell Collins technology uses liquid metal in a substrate for locally cooling electronics components and carrying waste heat to heat sinks. In this new technology, the liquid metal coolant (a compound of gallium, indium, and tin eutectic) is circulated using a high-reliability, solid-state pump that requires relatively low power. Because the substrates are simple and the cooling channels are very thin, this new approach requires very little liquid metal; the cost is therefore less than 10% that of liquid metal cooling systems that simply adapt water-based designs by replacing the water with liquid metal. This new technology is more comparable to heat pipes and vapor chambers, but with higher performance, gravity independence, mechanical flexibility, and tailorable thermal resistance, while the projected cost is similar to that of vapor chamber assemblies.growing demand electronic devices smaller operate higher power applications computers peak densities reaching 400-500 W/cm2and climbing increasingly difficult manage thermal output Increasing temperatures often lead decreased efficiency reliability |
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